Jason L. Frankel

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The multichip module (MCM) that contains the central electronic complex (CEC) of the S/390 ® G5 system is described in this paper. The glass-ceramic module, topped with six layers of polyimide full-field thin-film wiring for chip-to-chip interconnection, represents IBM's most advanced packaging technology. This MCM provides a large wiring capacity, with 595(More)
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