Jason A Sharpe

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Creating 3D integrated circuits (3DICs) by stacking electronic devices optimized for their substrate has the potential to increase system functionality while decreasing the overall footprint. Wafer thinning is a critical element in 3D integration and complicated by the fragile nature of a thin wafer. Thinning and post-process handling can be potentially(More)
UNLABELLED Staphylococcus simulans biovar staphylolyticus lysostaphin efficiently cleaves Staphylococcus aureus cell walls. The protein is in late clinical trials as a topical anti-staphylococcal agent, and can be used to prevent staphylococcal growth on artificial surfaces. Moreover, the gene has been both stably engineered into and virally delivered to(More)
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