James M Kallis

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The use of computerized thermal analysis to enhance the reliability of electronic products by identifying potential thermal problems at a point where designers can easily fix them is discussed. The reasons why thermal stress causes electronic components to fail are examined. The development of electronic and electrooptic equipment for designing and(More)
A method for nondestructive inspection of the thermal transfer effectiveness of adhesive bonds between the substrate and package (case) in the production of hybrid microcircuits is described. Because this bond is a series element in the thermal path for removal of the power dissipated by the microcircuit, its effectiveness is crucial to maintaining(More)
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