James Caserta

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The feasibility of integrating antennas and required circuits to form wireless interconnects in foundry digital CMOS technologies has been demonstrated. The key challenges including the effects of metal structures associated with integrated circuits, heat removal, packaging, and interaction of transmitted and received signals with nearby circuits appear to(More)
Inserting an Aluminum Nitride (AIN) layer which acts as a dielectric propagating medium between a silicon wafer containing integrated antennas and a metal chuck emulating the role of a heat sink improves the antenna power transmission gain by 8dB at 15GHz. AIN, with its high thermal conductivity also alleviates the heat removal problem. With a 760-pm AlN(More)
A wireless interconnect system for clock distribution which transmits and receives microwave signals across a chip using integrated antennas, receivers, and transmitters is presented. All of the com-ponents of the system are demonstrated at 15 GHz in a 0.18-m CMOS technology. Wireless interconnection is achieved over a distance of 5.6 mm.
The feasibility of integrating antennas and required circuits to form wireless interconnects in foundry digital CMOS technologies has been demonstrated. The key challenges including the effects of metal structures associated with integrated circuits, heat removal, packaging, and interaction of transmitted and received signals with nearby circuits appear to(More)
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