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Abstract Eutectic 80Au/20Sn solder is widely used for device packaging in optoelectronic and high power electronic industries. The knowledge of thermomechanical properties of the solder is critical… Continue Reading
In solder ball grid array (BGA) technology, solder joint reliability is one of the critical issues in microelectronics manufacturing industries. In this reliability aging study, Sn3.5AgO.7Cu solder… Continue Reading
A modified face-down bonding technique of ridge-waveguide laser diodes (LDs) using 80Au20Sn solder has been performed. For ease of manufacturability, a bonding window with good bonding integrity and… Continue Reading
Temperature characteristics and thermal resistance of InGaAs/GaAs laser diode (LD) is investigated from below to beyond the lasing threshold. Spectrally-resolved emission measurements show that the… Continue Reading