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In the microelectronics industry, power has traditionally been the key driver for thermal management. Cooling solutions are typically rated in terms of their power dissipation capacity and… (More)
Recent trends in the semiconductor industry are driving a continuous increase in power dissipation, but require a lighter, more compact and thinner packaging technology. One of the concern areas is… (More)
This paper reports the outcome of multiple environmental stresses subjected to quantify the thermal impedance value (Rjs) of a phase change thermal interface material for wave solder heat sink on a… (More)
This paper presents a novel thermal metrology that is based on non-uniform power distribution. This metrology has successfully been used for validating the cartridge thermal design of Pentium(R) III… (More)
This paper highlights thermal challenges of the Pentium/sup (R)/ III Xeon/sup TM/ processor and materials, and thermal management methods. Cartridge technology development to address thermal issues… (More)