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Article history: Received 3 June 2012 Received in revised form 25 June 2012 Accepted 27 June 2012 Available online 16 August 2012 0026-2714/$ see front matter 2012 Elsevier Ltd. A(More)
The thermomechanical behavior of power modules has been always an issue with regard to reliability improvement. Silver sintering technology is one of the few alternatives for die attachment, which(More)
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