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Brain computer interface (BCI) algorithms are used to predict the torque generation in the direction of shoulder abduction or elbow flexion using scalp EEG signals from 163 electrodes. Based on features extracted from both frequency and time domains, three classifiers are employed including support vector classifier, classification trees and K nearest(More)
Mechanisms underlying discoordination, expressed in the form of obligatory coupling between the shoulder and the elbow muscles following stroke, are probed by simultaneously recording 163-channel EEG together with elbow/shoulder torques and EMGs from the upper arm. With this unique experimental protocol, we were able to have strict post hoc control of a(More)
Copper wire bonding offers several mechanical and electrical advantages as well as cost saving compared to its gold wire predecessor. In the recent years, driven by the increasing price of gold, copper wire material and copper wire bonding process are widely researched for the high end IC packaging in the IC assembly area. In this paper, characterization(More)
This paper presents the results of a wire sweep improvement study for fine pitch devices. With 44mum fine pitch device as test vehicle, on one hand, transfer mold process optimization with transfer profile was performed and wire sweep was controlled below 5%; on the other hand, new FFT (Flow Free Thin) mold technology with new granular compound was also(More)
With driving interconnect dimensions to ever-smaller sizes, the RC delay becomes the dominant factor to impact IC performance. The RC delay time is controlled by the resistance of the metal lines in the interconnect structure of an IC, and the capacitance between the metal lines. To reduce RC delay, copper interconnects were introduced to replace aluminum.(More)
Copper wire bonding process has become popular interconnection process over gold because of its obvious cost advantages as well as lower electrical resistivity and good thermal conductivity. Recently, Pd-coated Cu wire is emerging as an alternative to bonding with bare Cu wire to prevent copper oxidation during the bonding and improve manufacturability [1].(More)
Copper wire has been popular in these years when facing ever-increasing gold prices. Recently, Pd-coated Cu wire is emerging as an alternative to bonding with bare Cu wire to prevent copper oxidation during the bonding and improve manufacturability. Compared to bare copper, Pd copper wire shows robust bonding process, especially offers 2nd bond and better(More)
Previous studies and clinical observations reveal that stroke survivors show the resurgence of the asymmetric tonic neck reflex (ATNR) both in static and dynamic conditions during maximal efforts. This observation may imply more reliance on the brainstem pathways following stroke. However, the effect of ATNR during a dynamic condition that represents more(More)
IC performance and cost drive interconnect dimensions to shrink to ever-smaller sizes the RC delay becomes the dominant factor to impact IC performance. The RC delay is a function of the product of the total resistance and capacitance of the whole interconnects structure. To reduce RC delay, copper interconnects were introduced to replace aluminum. At the(More)
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