J.-P. Celis

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The design and fabrication techniques for microelectromechanical systems (MEMS) and nanodevices are progressing rapidly. However, due to material and process flow incompatibilities in the fabrication of sensors, actuators and electronic circuitry, a final packaging step is often necessary to integrate all components of a heterogeneous microsystem on a(More)
This paper presents the different processing steps of a new generic surface micromachining module for MEMS hermetic packaging at temperatures around 180°C based on nickel plating and photoresist sacrificial layers. The advantages of thin film caps are the reduced thickness and area consumption and the promise of being a low-cost batch process. Moreover,(More)
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