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We have built and operated a wide band electrically small active antenna consisting of a YBa/sub 2/Cu/sub 3/O/sub 7/ half-loop over ground plane antenna, an LTS (niobium) 200 element DC SQUID array amplifier, and low-noise cryogenic GaAs buffer amplifier. These components were integrated with a liquid He flow cryostat into a portable stand-alone package.(More)
We have fabricated YBCO 90/spl deg/ grain boundary junctions on step edges in NdGaO/sub 3/ and in deposited dielectric (CeO/sub 2/ on YSZ and SrTiO/sub 3/ on MgO) in order to compare junction performance to our standard, LaAlO/sub 3/. Average I/sub c/R/sub n/ values at 77 K in the 300-400 /spl mu/V range were measured for 2 /spl mu/m step edge junctions on(More)
High-temperature superconductor step-edge junctions have been incorporated into a series array interferometer logic (SAIL) design, resulting in improvements in voltage and temperature performance. The junctions provide an I/sub c/R/sub n/ (critical-current normal-resistance) product of 300 mu V at 65 K, which makes it possible to have 100 mu V switching of(More)
YBa/sub 2/Cu/sub 3/O/sub 7/ (YBCO) step edge DC superconducting quantum interference devices (SQUIDs) have been developed which exhibit characteristics suitable for near-term incorporation into high-temperature superconductive (HTS) circuitry. Step-edge junction DC SQUIDs for series array interferometer logic (SAIL) digital applications exhibit resistively(More)
We have established a high temperature superconductor SNS junction fabrication process and are reproducibly fabricating junctions whose behavior is rooted in the physics of the proximity effect. SNS edge junctions are being fabricated using YBa/sub 2/Cu/sub 2.8/Co/sub 0.2/O/sub 7-/spl delta// (Co-YBCO) as the normal barrier, and YBa/sub 2/Cu/sub 3/O/sub(More)
One of the challenges In fabricating digital circuitry with high temperature superconductors (HTS) is in developing a reliable junction process. The requirements of this junction process include: low-parasitic inductance, well-targeted and reproducible total inductance, uniformity in I/sub c/ and R/sub n/, and also well-targeted I/sub c/ and I/sub c/R/sub(More)
A series of experiments were performed in a Taguchi experimental matrix to examine and compare critical fabrication process factors in junction electrical performance. Factors such as angle of HTS deposition by pulsed laser deposition (PLD), pre-cleaning and annealing dwell time prior to epitaxial depositions, and angle of film edges created by ion milling(More)
Hysteretic YBa/sub 2/Cu/sub 3/O/sub 7/ step-edge junctions on LaAlO/sub 3/ substrates have been fabricated by shunting intrinsically overdamped junctions with a monolithic capacitor. By comparing the I-V curves of junctions fabricated on the same substrate with and without capacitor counterelectrodes, the authors are confident that the observed hysteresis(More)
For applications where extremely low-noise amplifiers are demanded, RF SQUID parametric amplifiers offer significant capabilities. We present results on the first RF SQUID parametric amplifiers (paramp) fabricated using TRW's YBCO integrated circuit process technology. TRW's paramps consist of thousands of RF SQUIDs distributed along and coupled to /spl(More)
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