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The rate-dependent deformation behavior of Sn3.8AgO.7Cu Pb-free alloy and Sn-Pb eutectic alloy under constant and variable shearing strain rates and creep conditions was studied systematically with thin-walled specimens using a biaxial servo-controlled tension-torsion material testing system. The shearing tests were conducted at strain rates between 10/sup(More)
The problem is posed and solved for the oceanic surface boundary layer in the presence of wind stress, stable density stratification, equilibrium wind-waves, and remotely generated swell-waves. The addition of swell causes an amplification of the Lagrangian-mean current and rotation toward the swell-wave direction, a fattening of the Ekman velocity spiral(More)
It has been long believed that residual stress is the root cause for tin whisker formation on pure tin-plated component leads. However, tin whisker formation could be observed on the surface of other tin-based alloys under certain conditions. In this study, the whisker formation was reported on a coating layer of Sn-Pb eutectic hot air solder leveling(More)
Summary form only given. It has been long believed that residual stress is the root cause of tin whisker formation on pure tin-plated component leads. However, tin whiskering also happens to a lesser degree on other tin-based alloys under certain conditions. In this study, the tin whisker phenomena were reported on Sn-Pb HASL coating layer inside plated(More)
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