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The creep and fatigue properties of 95.5Sn-3.8Ag-0.7Cu lead free solders were investigated. Steady-state creep behavior for 95.5Sn-3.8Ag-0.7Cu bulk solder specimens were compared to reported creep test data for solder joints. Tests were carried out at four different temperatures (-40/spl deg/C, 25/spl deg/C, 75/spl deg/C and 125/spl deg/C) and a range of(More)
Both elastic-plastic-creep and viscoplastic constitutive models may be used for inelastic deformation analysis of solder joints. In this paper, a phenomenological approach using elastic-plastic-creep analysis and an Anand viscoplastic model is reported for solder joint reliability. Flip chip soldered assemblies with 63Sn-37Pb solder joints were subjected to(More)
Mechanical properties for 95.5Sn&#8211;3.8Ag&#8211;0.7Cu solder alloy were derived from bulk specimen tensile test and lap shear solder joint tests specimen. The tensile tests were carried out at three temperatures (25<tex>$^circhbox C$</tex>, 75<tex>$^circhbox C$</tex>, and 125<tex>$ ^circhbox C$</tex>) and at three different strain rates (<tex>$5.6times(More)
In this work, thermal cycling reliability test and analysis for PBGA components with Sn-3.8Ag-0.7Cu solder joints were investigated. Based on test results, a two-parameter Weibull distribution model was used to determine the mean time to failure (MTTF) of PBGA components. The MTTF was used for validation of finite element analysis (FEA) results. FEA(More)
Board-level drop reliability test and analysis requires dynamic characterization of high strain-rate properties of bulk solder and solder joint failure tests. Drop impact analysis of board-level dynamic response (ie: G-levels and board bending strains) and over-simplification of deformation response of solder joints (ie: assuming elastic stress criteria)(More)
The trend in die size decrease of the microelectronics circuits has been driven by modern IC manufacturing technology. Due to its brittle nature, high stresses induced in the die due to packaging, assembly and reliability test could result in detrimental fracture in the die. Due to its large diameter and thin layer, determination of the fracture strength of(More)
The growth of interfacial intermetallic compounds (IMC) between Pb-free and Pb-based solders with different surface finish (Cu and Ni/Au) metallization is a major concern for long-term solder joint reliability performance in electronic assemblies. The growth rate of the IMC layer can affect the solder joint reliability. Analysis of solid-state diffusion(More)
Portable electronic products such as cellular phones, PDAs, and MP3 units are increasingly designed for accidental drop. Repeated drop events can lead to solder joint failure and malfunction of these products. Hence board-level reliability drop testing is a useful way to characterize the drop durability of the printed circuit board with different soldered(More)
Thermal-mechanical behavior of materials and reliability assessment of semiconductor packages are two of key issues in electronic packaging. Digital image correlation method is increasingly used for thermal deformation characterization in electronic packaging in recent years. For example, the deformation measurements of solder joints in various(More)
Lead free SnAgCu solder joints used in surface mount packages like Ball Grid Array (BGA) have a great impact on the reliability of the end product. The mechanical properties of the solder are important factors. By changing the concentration of silver and copper, or by doping a very low portion of the fourth element (e.g. Ni), the strength of solder can be(More)