J. G. A. Theeven

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A digital image correlation (DIC) algorithm was employed to measure microscopic strain-field evolution in shear-loaded model solder interconnections made out of a number of Sn-based alloys. Four different solder alloys studied were Sn–36Pb–2Ag, Sn–3.8Ag–0.7Cu (SAC), Sn–3.3Ag–3.82Bi, and Sn–8Zn–3Bi. The measured strain fields were correlated with damage(More)
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