J.B. Fortin

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We present a design, process How, and packaging scheme for a novel three-dimensional capacitive microelectromechanical systems pressure sensor [1], [10]. These sensors present a paradigm shift in pressure sensor technology. They contain an array of vertical diaphragms perpendicular to the wafer plane where each pair of diaphragms requires orders of(More)
We present the design, process flow and packaging scheme for a novel 3D capacitive MEMS pressure sensor. These sensors present a paradigm shift in pressure sensor technology. They contain an array of vertical diaphragms perpendicular to the wafer plane where each pair of diaphragms requires orders of magnitude lower footprint than traditional in-plane(More)
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