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The properties of epoxy based materials alter, when exposed to humid environment and temperature. To better understand the failure mechanisms on microelectronic packaging we examine these epoxies (aromatic epoxy: l,3-Bis-(2,3-epoxypropyl)-benzene and amine hardener: 1,2-Diaminoethan ) under different initial conditions of temperature (300-400 K) &(More)
The authors first investigate a polymeric composite material ( epoxy resin with silicone nanoparticles) and determine its mechanical properties (coefficient of thermal expansion-CTE and Young's Modulus-E) by a combined experimental and simulative (homogenisation) approach. The size distribution and the volume fraction percentage of the nanoparticles were(More)
One of the most prominent failure modes in microelectronics devices is the delamination of epoxy materials (adhesives, molding compounds). The thermal mismatch at the interface between materials leads to stresses that build up during processing steps at different temperatures and in the following thermal cycling through use of the device or reliability(More)
An analysis of moisture transport through the bulk of a crosslinked epoxy has been performed experimentally and by molecular dynamics simulations. It was shown that results of the diffusion coefficient compare well for the investigated system and an analysis of the activation energy gives reasonable agreement between experiment and simulation.
For electronic application many polymer systems such as thermosets and thermoplastics with different properties are widely used. Thermosetting polymers e.g. epoxy resins, cause reliability problems when exposed to humid environments where phenomena such as moisture absorption and diffusion take place. It is important to know both absorption and desorption(More)
In this paper the potential of molecular dynamics simulation for structure-property correlations in epoxy-resins is discussed. This is a topic relevant for a multi-scale framework to lifetime prediction in microelectronics packaging. To achieve that objective, epoxy-resins are synthesised by systematically varying their chemical structure and then(More)
In this work we present our results of an approach to assess material property changes with time due to high temperature ageing in an isotropic conductive adhesive. A molecular model of an epoxy with similar primary chemistry is investigated by molecular dynamics simulations. By variation of crosslink density, one supposed effect of ageing (post-curing) is(More)
Fan-out Wafer Level Packaging (FOWLP) is one of the latest packaging trends in microelectronics for heterogeneous system integration. This paper describes the technological path from wafer level embedding to 24"×18" fan-out panel level packaging technology in combination with low cost PCB based RDL processes and discusses challenges and opportunities(More)