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The properties of epoxy based materials alter, when exposed to humid environment and temperature. To better understand the failure mechanisms on microelectronic packaging we examine these epoxies (aromatic epoxy: l,3-Bis-(2,3-epoxypropyl)-benzene and amine hardener: 1,2-Diaminoethan ) under different initial conditions of temperature (300-400 K) &(More)
Microtechnology becomes a versatile tool for biological and biomedical applications. Microwells have been established long but remained non-intelligent up to now. Merging new fabrication techniques and handling concepts with microelectronics enables to realize intelligent microwells suitable for future improved cancer treatment. The described technology(More)
Novel nontoxic (S)-2-aminoalkylbenzimidazole derivatives were found to be effective against Candida spp. at low micromolar concentrations using high-throughput screening with infected HeLa cells. A collection of analogues defined the chemical groups relevant for activity. The most active compound was characterized by transcriptional analysis of the response(More)
Fungal infections are a serious health problem in clinics, especially in the immune-compromised patient. Disease ranges from widespread superficial infections like vulvovaginal infections to life-threatening systemic candidiasis. Especially for systemic mycoses, only a limited arsenal of antifungals is available. The most commonly used classes of antifungal(More)
For electronic application many polymer systems such as thermosets and thermoplastics with different properties are widely used. Thermosetting polymers e.g. epoxy resins, cause reliability problems when exposed to humid environments where phenomena such as moisture absorption and diffusion take place. It is important to know both absorption and desorption(More)
An analysis of moisture transport through the bulk of a crosslinked epoxy has been performed experimentally and by molecular dynamics simulations. It was shown that results of the diffusion coefficient compare well for the investigated system and an analysis of the activation energy gives reasonable agreement between experiment and simulation.
One of the most prominent failure modes in microelectronics devices is the delamination of epoxy materials (adhesives, molding compounds). The thermal mismatch at the interface between materials leads to stresses that build up during processing steps at different temperatures and in the following thermal cycling through use of the device or reliability(More)
The authors first investigate a polymeric composite material ( epoxy resin with silicone nanoparticles) and determine its mechanical properties (coefficient of thermal expansion-CTE and Young's Modulus-E) by a combined experimental and simulative (homogenisation) approach. The size distribution and the volume fraction percentage of the nanoparticles were(More)