Ivan Penskiy

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— The first MEMS process integrating soft elas-tomers in a standard silicon-on-insulator (SOI) wafer without assembly has been demonstrated for use in microrobotic mechanisms. This process allows silicon and poly(dimethylsiloxane) (PDMS) features to be defined in-plane with feature sizes down to 2 µm. Test structures have been used to characterize the(More)
This work demonstrates the first low cost, all-elastomer capacitive tactile arrays compatible with roll-to-roll manufacturing. A new manufacturing process has been developed in which elastomer sheets are covered with a stencil, spray coated with conductive elastomer on one or both sides, and stacked to create the sensor array. These arrays are highly(More)
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