Itir Akgun

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In-memory computing is emerging as a promising paradigm in commodity servers to accelerate data-intensive processing by striving to keep the entire dataset in DRAM. To address the tremendous pressure on the main memory system, discrete memory modules can be networked together to form a memory pool, enabled by recent trends towards richer memory interfaces(More)
3D Integration is a promising technology to continue the trend of Moore's law. However, higher density from die stacking introduces thermal challenges that require more expensive packaging and cooling solutions. An alternative integration technology is interposer-based 2.5D design, which has fewer thermal issues but adds extra interposer cost. Designers(More)
Three-dimensional (3D) integration is considered as a solution to overcome capacity, bandwidth, and performance limitations of memories. However, due to thermal challenges and cost issues, industry embraced 2.5D implementation for integrating die-stacked memories with large-scale designs, which is enabled by silicon interposer technology that integrates(More)
Due to the increasing fabrication and design complexity with new process nodes, the cost per transistor trend originally identified in Moore's Law is slowing when using traditional integration methods. However, emerging die-level integration technologies may be viable alternatives that can scale the number of transistors per integrated device while reducing(More)
High-performance computing, enterprise, and datacenter servers are driving demands for higher total memory capacity as well as memory performance. Memory "cubes" with high per-package capacity (from 3D integration) along with high-speed point-to-point interconnects provide a scalable memory system architecture with the potential to deliver both capacity and(More)
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