Ioannis Tsioutsios

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——A physical model for the design of the power distribution networks in three-dimensional integrated circuits is proposed. The tradeoffs among the different design parameters are specified and analyzed. Different case studies are explored, indicating that smaller and denser TSVs can deliver power more efficiently as compared to larger and coarsely(More)
— Several challenges should be resolved for three-dimensional integration to evolve to a mainstream technology. Among these challenges, the issues of synchronization and power integrity become predominant due to the multiple planes and the heterogeneity of 3-D circuits. The paper offers an overview of the state of the art research related to these global in(More)
Suspended monolayer transition metal dichalcogenides (TMD) are membranes that combine ultralow mass and exceptional optical properties, making them intriguing materials for opto-mechanical applications. However, the low measured quality factor of TMD resonators has been a roadblock so far. Here, we report an ultrasensitive optical readout of monolayer TMD(More)
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