Ioannis Tsioutsios

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——A physical model for the design of the power distribution networks in three-dimensional integrated circuits is proposed. The tradeoffs among the different design parameters are specified and analyzed. Different case studies are explored, indicating that smaller and denser TSVs can deliver power more efficiently as compared to larger and coarsely(More)
Graphene is an attractive material for nanomechanical devices because it allows for exceptional properties, such as high frequencies, quality factors, and low mass. An outstanding challenge, however, has been to obtain large coupling between the motion and external systems for efficient readout and manipulation. Here, we report on a novel approach, in which(More)
Mechanical resonators based on low-dimensional materials provide a unique platform for exploring a broad range of physical phenomena. The mechanical vibrational states are indeed extremely sensitive to charges, spins, photons, and adsorbed masses. However, the roadblock is often the readout of the resonator, because the detection of the vibrational states(More)
We report on the fabrication and operation of a multi-element vibrational structure consisting of two graphene mechanical resonators coupled by a nanotube beam. The whole structure is suspended. Each graphene resonator is clamped by two metal electrodes. The structure is fabricated using a combination of electron-beam lithography and atomic-force microscopy(More)
Suspended monolayer transition metal dichalcogenides (TMD) are membranes that combine ultralow mass and exceptional optical properties, making them intriguing materials for opto-mechanical applications. However, the low measured quality factor of TMD resonators has been a roadblock so far. Here, we report an ultrasensitive optical readout of monolayer TMD(More)
Several challenges should be resolved for threedimensional integration to evolve to a mainstream technology. Among these challenges, the issues of synchronization and power integrity become predominant due to the multiple planes and the heterogeneity of 3-D circuits. The paper offers an overview of the state of the art research related to these global in(More)
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