Metallic Phase with Long-Range Orientational Order and No Translational Symmetry
- D. Shechtman, I. Blech, D. Gratias, J. Cahn
- Materials Science
- 12 November 1984
We have observed a metallic solid (Al-14-at.%-Mn) with long-range orientational order, but with icosahedral point group symmetry, which is inconsistent with lattice translations. Its diffraction…
Electromigration in thin aluminum films on titanium nitride
- I. Blech
- Materials Science
- 1 April 1976
The aluminum electromigration drift velocity was measured at the temperature range 250–400 °C. A threshold current density was found inversely proportional to the stripe length. An activation energy…
Stress generation by electromigration
- I. Blech, C. Herring
- Materials Science
- 1 August 1976
Stresses in aluminum thin films on TiN were studied in situ by transmission x‐ray topography. Stress gradients were seen to build up in thin aluminum films during passage of electrical currents. The…
Electromigration in thin gold films on molybdenum surfaces
- I. Blech, E. Kinsbron
- Materials Science
- 1 February 1975
Multiple Scattering of Neutrons in Vanadium and Copper
- I. Blech, B. Averbach
- Materials Science
- 15 February 1965
Measurement of stress gradients generated by electromigration
Stress gradients generated by electromigration in aluminum films were measured at 340 °C. The stresses were measured by combining x‐ray topography to record the effects of the film stress and…
Diffusional back flows during electromigration
- I. Blech
- Engineering
- 1 July 1998
Enhanced X‐Ray Diffraction from Substrate Crystals Containing Discontinuous Surface Films
- I. Blech, E. S. Meieran
- Physics
- 1 June 1967
The lattice distortions in single‐crystal Si substrates due to stressed surface films were calculated by linear elastic theory. It is shown that the strains are localized directly underneath…
DIRECT TRANSMISSION ELECTRON MICROSCOPE OBSERVATION OF ELECTROTRANSPORT IN ALUMINUM THIN FILMS
- I. Blech, E. S. Meieran
- Physics
- 15 October 1967
Electrotransport in thin Al strips was directly observed by transmission electron microscopy. As expected, hole formation was seen in regions where the electron flow was in the direction of…
Step coverage simulation and measurement in a dc planar magnetron sputtering system
The step coverage of a dc planar magnetron sputtering system with a revolving substrate is analyzed by both computer simulation and measurement of the step coverage. The model assumes line of sight…
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