I.Y. Mizushima

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Stress-induced voiding under vias connected to "narrow" Copper (Cu) lines (SIV-N) was observed, for the first time, using newly prepared test structures which consisted of isolated vias between narrow (0.14 mum-wide) and very long (200 mum-long) 2-level Cu wires. Mechanism of SIV-N is different from that of well-known stress-induced voiding under vias(More)
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