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* © IEEE 1996, from Third Conference on Massively Parallel Processing using Optical Interconnect, Maui, HI, October 1996, pages 44-52. Abstract Focal plane processing applications present a growing computing need for portable telecomputing and videoputing systems. This paper demonstrates the integration of digital processing, analog interface circuitry, and(More)
This paper introduces Pica, a fine-grain, message passing architecture designed to efficiently support high-throughput parallel applications. This focus on high-throughput applications allows a small local memory of 4096 36-bit words. The architecture minimizes overhead for basic parallel operations. An operand-addressed context cache and round-robin task(More)
This paper introduces Pica, a ne-grain, message passing architecture designed to eeciently support high-throughput parallel applications. The architecture minimizes overhead for basic parallel operations. An operand-addressed context cache and round-robin task manager allow single cycle task swaps. Fixed-sized activation contexts simplify storage(More)
Integrated optoelectronic interconnect offers a potentially lower cost, higher density alternative to wire-based technologies for I/O. For most applications, low cost IC packages provide an effective means of I/O in a system. However, some applications, such as image processing, require higher levels of off-chip I/O bandwidth than can be provided using(More)
High frame rate infrared scene generation depends on high performance digital processors that are tightly coupled to infrared emitter arrays. Massively parallel image generation hardware can realize the type of high throughput, high frame rate processing that will characterize the next generation of scene generators. This work outlines projects in massively(More)
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