Hushrav Mogal

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Advances in the chip fabrication technology have begun to make manufacturing 3D chips a reality. For 3D designs to achieve their full potential, it is imperative to develop effective physical design strategies that handle the complexities and new objectives specific to 3D designs. We present two frameworks of placement and routing techniques, for 3D FPGA(More)
We present timing-driven partitioning and simulated annealing based placement algorithms together with a detailed routing tool for 3D FPGA integration. The circuit is first divided into layers with limited number of inter-layer vias, and then placed on individual layers, while minimizing the delay of critical paths. We use our tool as a platform to explore(More)
We present a new linear time technique to compute criticality information in a timing graph by dividing it into "zones". Errors in using tightness probabilities for criticality computation are dealt with using a new clustering based pruning algorithm which greatly reduces the size of circuit-level cutsets. Our clustering algorithm gives a 150<i>X</i>(More)
With ever-shrinking device geometries, process variations play an increased role in determining the delay of a digital circuit. Under such variations, a gate may lie on the critical path of a manufactured die with a certain probability, called the criticality probability. In this paper, we present a new technique to compute the statistical criticality(More)
This paper introduces a novel 3-Dimensional (3D) vertically integrated adaptive computing system. This 3D-SoftChip is a combination of state-of-the-art processing and interconnection technology. It comprises the vertical integration of two chips (a Configurable Array Processor and an Intelligent Configurable Switch) through indium bump 3D interconnections.(More)
This paper presents a new approach to active sub-threshold leakage reduction using task migration. The main idea is to replicate a <i>hot</i> module in a design so as to actively migrate its computation at regular intervals, reducing the on-chip temperature and thereby the subthreshold leakage. We observe that choosing which blocks to migrate and their(More)
Lateral heat conduction between modules affects the temperature profile of a floorplan, affecting the leakage power of individual blocks which increasingly is becoming a larger fraction of the overall power consumption with scaling of fabrication technologies. By modeling temperature dependent leakage power within a microarchitecture-aware floorplanning(More)
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