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  • Snehalatha Movva, Steve Bezuk, +11 authors Kim Yee Lee
  • Materials Science
  • IEEE 61st Electronic Components and Technology…
  • 2011 (First Publication: 1 May 2011)
  • An innovative packaging solution — ‘Cu-column on BOL’ (CuBOL) is developed that dramatically reduces flip chip package cost and offers superior product reliability, thus posing an important flip chipContinue Reading