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Three-dimensional network-on-chip (3D NoC) has been proposed to solve the complex on-chip communication issues in future 3D multicore systems. However, the thermal problems of 3D NoC are more serious than 2D NoC due to chip stacking. To keep the temperature below a certain thermal limit, the thermal emergent routers are usually throttled. Then, the topology(More)
—The distribution of traffic and temperature in a high-performance three dimensional Network-on-Chip (3D NoC) system become more unbalanced because of chip stacking and applied minimal routing algorithms. To regulate the temperature under a certain thermal limit, the overheated nodes are usually throttled by run-time thermal management (RTM). Therefore, the(More)
The thermal issue is important for 3D Network-on-Chip systems. To ensure the thermal safety, the near-overheat routers are throttled and the 3D topology becomes Non-Stationary Irregular Mesh (NSI-Mesh). To ensure the successful packet delivery in the NSI-Mesh, Transport Layer Assisted Routing (TLAR) scheme was proposed. It has better performance than the(More)
The thermal problem of three-dimensional Network-on-Chip (3D NoC) is severer than 2D NoC because chip stacking. To keep the temperature below a certain thermal limit, the near-overheat routers are throttled and the 3D topology becomes Non-Stationary Irregular Mesh (NSI-Mesh). To ensure the successful packet delivery in the NSI-Mesh, Transport Layer Assisted(More)
The traffic and thermal problems of high performance three-dimensional Network-on-Chip (3D NoC) system become more unbalanced because of chip stacking and applied minimal routing algorithm. To make the temperature under a certain thermal limit, the overheat nodes are throttled by run-time thermal management (RTM). Therefore, the network topology becomes a(More)
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