Hui Min Lee

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This paper presents a compact wideband equivalent circuit model for electrical modeling of through-silicon vias (TSVs) in 3-D stacked integrated circuits and packaging. Rigorous closed form formulas for the resistance and inductance of TSVs are de rived from the magneto-quasi-static theory with a Fourier-Bessel expansion approach, whereas analytical(More)
This paper presents a two-dimensional discontinuous Galerkin time-domain (2-D DGTD) method for modeling arbitrarily shaped power-ground planes in high-speed electronics. The DGTD method has advantage over the finite-difference time-domain method in handling complex geometries, and allows high-order spatial discretization for improved accuracy. Its explicit(More)
Through silicon vias (TSV) are critical vertical interconnects in 3D IC. We comparatively studied the signal integrity of different designs of TSVs both existing and new in a single die up to 20 GHz. For TSVs in multiple die stacking, we proposed to use the cascaded scattering matrix approach for their signal integrity analysis. The results are validated(More)
Evaluation of the impact caused by Through-Silicon Vias (TSV) induced thermo-mechanical stress on device performance is becoming important due to the close proximity between TSVs and the semiconductor devices in 3D integration. From the literatures, there exist discrepancies between theory, simulated and experimental results presented. For accurate(More)
Through-silicon via (TSV) technology is one of the enabling technologies for the next generation of advanced three-dimensional circuit integration. We first investigate the impact of technology scaling on the electrical characteristics of TSVs in terms of scattering parameters up to 40 GHz. This covers the geometry scaling predicted by the ITRS 2010 for(More)
Impact caused by Through-Silicon Via (TSV) induced thermo-mechanical stress on device performance has been a concern for three-dimensional (3D) integrated circuit (IC) integration because of the close proximity of TSVs to semiconductor devices. From the literatures, there are conflicting reports between theory, simulated and experimental results. For(More)
Undifferentiated nasopharyngeal carcinoma (NPC) is a cancer with high metastatic potential that is consistently associated with Epstein-Barr virus (EBV) infection. In this study, we have investigated the functional contribution of sphingosine-1-phosphate (S1P) signalling to the pathogenesis of NPC. We show that EBV infection or ectopic expression of the(More)
This paper reports an effective resistance approach with an accurate closed-form formula for fast static IR drop analysis of the power grid on a Through-Silicon Interposer (TSI). Numerical validation of the approach is performed against the SPICE simulation.
A simple but effective common-mode noise suppression filter using cavity-backed defected ground structure (DGS) is proposed for the application of multilayer printed circuit board (PCB). This filter adds a substrate-filled metallic cavity beneath a conventional DGS. Due to the shielding effect of the cavity, the back-radiation of the DGS can be(More)
This paper presents power integrity modeling and measurement of through-silicon via (TSV)-based 3D IC system. To leverage the accuracy of a full-wave approach and shorter computational time of a circuit approach, a hybrid full-wave and circuit approach is proposed to model each individual chip consisting of TSVs, on-chip power grids and decoupling(More)