Hui-Gon Chun

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The effects of the thickness and grain size on the mechanical properties of thin polycrystalline Cu and Ag films on silicon substrates are investigated by nanoindentation. At small indentation depths the results are affected by the tip radius of the Berkovich indenter and the response of indented films at first stages of loading is adequately represented by(More)
Chromium nitride (CrN) films were deposited by using inductively coupled plasma (ICP) assisted RF magnetron sputtering to investigate the effect of substrate bias voltage on the hardness, surface morphology roughness, and crystalline growth on Si(100) substrate. As increasing substrate bias voltage (Vb), surface hardness increased from 5 to 15 GPa. The(More)
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