Hsueh-Chung Chen

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This paper sets new speed records for ECM, the elliptic-curve method of factoriza-tion, on several different hardware platforms: GPUs (specifically the NVIDIA GTX), x86 CPUs with SSE2 (specifically the Intel Core 2 and the AMD Phenom), and the Cell (specifically the PlayStation 3 and the PowerXCell 8i). In particular, this paper explains how to carry out(More)
As the dimension of copper interconnect scales into the nano-meter regime, the resistivity of copper rapidly increases, primarily due to an electron scattering effect and other dimensional dependent factors, such as film quality. In this paper, we attempt to use a simplified parameter, dimension impact factor (DIF), which includes both surface and grain(More)
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