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—In this paper, thermoelastic damping (TED) in trench-refilled (TR) polysilicon microelectromechanical beam resonators is studied as a mechanism for limiting quality factor () at low frequencies. An approximate model based on Zener's theory is developed and verified by numerical simulations in FEMLAB. According to the proposed model a double-dip(More)
— This paper reports on the design, implementation, and characterization of high-density trench-refilled capacitors in complementary metal–oxide–semiconductor (CMOS) grade silicon (1–10 cm). High aspect ratio trench-refilled capacitors offer a capacitance density improvement of three orders of magnitude compared to thin-film capacitors with the same die(More)
The gauge boson pair production processes W␥, WW, WZ, and Z␥ were studied using p p ¯ collisions corresponding to an integrated luminosity of approximately 14 pb Ϫ1 at a center-of-mass energy of ͱsϭ1.8 TeV. Analysis of W␥ production with subsequent W boson decay to l ␯ (l ϭe,␮) is reported, including a fit to the p T spectrum of the photons which leads to(More)
— The paper reports a CMOS Interface IC designed for electrostatic actuation and read-out a 6MHz Silicon Bulk Acoustic Wave (BAW) gyroscope. The supporting electronics for a high quality factor (Q>100,000) BAW gyroscope include: an electro-mechanical drive oscillator loop to excite the gyroscope, a low noise transimpedance front-end that offers gain of(More)
This paper introduces the design and implementation of center-supported bulk acoustic wave (BAW) disk resonators on silicon-on-insulator (SOI) substrates. The use of a SOI substrate enables implementation of single crystal silicon disk resonators and provides electrical isolation between the disk and the substrate. A center-supported 800tm in diameter(More)
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