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— Process variations are of increasing concern in today's technologies, and can significantly affect circuit performance. We present an efficient statistical timing analysis algorithm that predicts the probability distribution of the circuit delay considering both inter-die and intra-die variations, while accounting for the effects of spatial correlations(More)
We present an efficient statistical timing analysis algorithm thatpredicts the probability distribution of the circuit delay while incorporatingthe effects of spatial correlations of intra-die parametervariations, using a method based on principal component analysis.The method uses a PERT-like circuit graph traversal, and hasa run-time that is linear in the(More)
In this paper, we present a method for analyzing the leakage current, and hence the leakage power, of a circuit under process parameter variations that can include spatial correlations due to intra-chip variation. A lognormal distribution is used to approximate the leakage current of each gate and the total chip leakage is determined by summing up the(More)
Variability of process parameters makes prediction of digital circuit timing characteristics an important and challenging problem in modern chip design. Recently, statistical static timing analysis (statistical STA) has been proposed as a solution. Unfortunately, the existing approaches either do not consider explicit gate delay dependence on process(More)
In this article, we present a method to analyze the total leakage current of a circuit under process variations, considering interdie and intradie variations as well as the effect of the spatial correlations of intradie variations. The approach considers both the subthreshold and gate tunneling leakage power, as well as their interactions. With process(More)
—We propose eP lace-M S, an electrostatics based placement algorithm for large-scale mixed-size circuits. ePlace-MS is generalized, flat, analytic and nonlinear. The density modeling method eDensity is extended to handle the mixed-size placement. We conduct detailed analysis on the correctness of the gradient formulation and the numerical solution, as well(More)
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