Hitoshi Kino

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High density 3D LSI technology using W/Cu hybrid through silicon vias (TSVs) has been proposed. Major reliability issues attributed to W/Cu hybrid TSVs in high density 3D LSIs such as (i) thermo-mechanical stress exerted by W TSVs used for signal lines and Cu TSVs used for power/ground lines in active Si, (ii) external gettering (EG) role played by(More)
BACKGROUND Gastric endoscopic submucosal dissection (ESD) has gradually come to be recommended as the optimal treatment for early gastric cancer; however, one of the primary issues is postoperative bleeding. Although second-look endoscopy is conventionally performed to reduce the risk of postoperative bleeding, its benefit has not yet been clearly(More)