Hiroyuki Nagatomo Yamazaki

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Advancements in packaging technologies are required to meet the future bandwidth, and space- and energy-efficient demands of ICT systems. One of the key technologies is 2.5D packaging using a silicon interposer with through silicon vias (TSVs). However, forming the TSV and thinning the wafer makes the Si interposer's cost high. Furthermore, using an organic(More)
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