Hironori Tohmyoh

Learn More
To precisely examine the electrical failure behavior of a metallic nanowire mesh induced by Joule heating (i.e., melting), a previously developed numerical method was modified with regard to the maximum temperature in the mesh and the electrical resistivity of the nanowire. A sample case of an Ag nanowire mesh under specific working conditions was analyzed(More)
Compared to the usual water immersion case, more effective transmission and reception of high-frequency ultrasound through a thin, solid layer are reported. A theoretical model is presented to perform the signal amplification and the signal modulation toward the higher frequency components for getting the high-quality acoustic images without immersing the(More)
To accomplish a high-resolution ultrasonic imaging without wetting a sample, the efficiency of the dry-contact ultrasonic transmission is discussed. In this study, a dry-contact interface is formed on a sample by inserting a thin film between water and a sample, and the pressure is working on the interface by evacuating the air between the film and the(More)
Aluminum microspheres with diameters of 4-7 microm have been fabricated by utilizing electromigration. In a passivated Al line with a slit at the anode end, atoms accumulated before the slit due to high current density and high substrate temperature are released from the pre-introduced holes in the passivation layer, and form microspheres with aid of(More)
This paper reports on a technique to measure the acoustic properties of a thin polymer film utilizing the frequency dependence of the reflection coefficient of ultrasound reflected back from a system comprising a reflection plate, the film, and a material that covers the film. The frequency components of the echo reflected from the back of the plate, where(More)
The potential of the water-immersion and dry-contact acoustic imaging techniques for detecting nanometer gaps embedded in silicon is studied. The sensitivity for detecting gaps of over 10 nm in height is governed only by the lateral resolution of the imaging and is independent of the height of the gap.
The sensitivity of acoustic microscopy for detecting three-dimensional defects in a Si structure is reported. Circular, nanometer gaps with diameters ranging from 5 to 1000 microm were embedded in Si disks by a direct bonding technique, and these were visualized using acoustic microscopy. The limits of detection for the gap thickness and diameter were(More)