Hideki Miyajima

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Adhesion tests for a real Cu/low-k patterned structure were studied for 45-nm node devices. Results from 4 point-bending (4PB) and modified edge lift-off tests (m-ELT) were compared. Cu dual(More)
Electromigration testing pattern to identify the dominant diffusion path of Copper (Cu) damascene interconnects is proposed. It is confirmed that dominant diffusion path is the interface between Cu(More)