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- Michael Töpper, Ivan N. Ndip, +6 authors Herbert Reichl
- 2010 Proceedings 60th Electronic Components and…
- 2010
Interposers for SiP will become more and more important for advanced electronic systems. But through substrate vias are essential for the 3-D integration. Being a standard for laminate based… (More)
- Lars Brusberg, Henning Schröder, +4 authors Herbert Reichl
- 2010 Proceedings 60th Electronic Components and…
- 2010
Glass as a carrier material for electrical and optical interconnects has many benefits compared to conventional materials like silicon, ceramic or polymer based laminates because of its excellent… (More)
- Gregory John Jordan, Denis McCarthy, Norbert Schlepple, Jan Starbug Krissler, Henning Schröder, Guggi Kofod
- IEEE/ASME Transactions on Mechatronics
- 2011
Analysis of the operating characteristics of a dielectric elastomer actuator (DEA) submount for the high-precision positioning of optical components in one dimension is presented. Precise alignment… (More)
- Henning Schröder, Marcel Neitz, Simon A. Whalley, Christian Herbst, Christopher Frey
- 2016 IEEE 66th Electronic Components and…
- 2016
Introduction of proposed electro-optical circuit board (EOCB) technologies based on embedded glass waveguides in the system enclosure of data storage, compute or switch platforms will be instrumental… (More)
- Henning Schröder, Lars Brusberg, +4 authors Herbert Reichl
- 2010 Proceedings 60th Electronic Components and…
- 2010
We introduce thin glass for electrical-optical integration on module level. Glass is regarded as promising material for high frequency wiring to drive the e/o components having additional advantages… (More)
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