Heechun Park

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Recently, to cope with clock TSV (Through-Silicon-Via) reliability problem efficiently, a new circuit structure called TSV Fault-tolerant Unit (TFU) and the allocation method of TFUs have been proposed. However, the existing design methods partially or never addressed following key issues: (1) <i>the feasibility of TSV pairing for TFU allocation</i>, (2)(More)
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