Harald Fritzsche

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The complete SMD-mounting process is a complex superposition of a lot of influences. There are general material (SMD-components, printed boards, solder paste, printing stencil), geometrical (layout) and process (solder paste printer, assembling equipment and their setup) influences. The main goal is the maximization of the process capabilities of the(More)
For the evaluation of the of wire bonders placement accuracy are still no generally accepted procedures and methods available. The requirements on placement accuracy and its evaluation will further increasing in the next time. Ongoing miniaturization and upcoming international standards make it necessary, to evaluate and document the machine capability(More)
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