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Electromigration phenomena in Sn-3.5Ag solders with Cu pillar in the flip chip joints was investigated. The silicon die was mounting on a silicon substrate via thermal-compression bonding process.… (More)
OBJECTIVE To evaluate the osteogenetic character and repairing maxillary sinus superior wall fractures capability of calcium phosphate cement (CPC) before and after combined with recombinant human… (More)
In order to develop the flux dipping process, a quantitative mathematical model that accurately describes the flux dipping process in the flip-chip bonding is proposed. The whole dynamic dipping… (More)
In this paper, A semi-physical method for calculating time varying mesh stiffness and the dynamic response of gear system based on experimental strain data is studied. In a previous work, it was… (More)
Fiber Bragg grating has been widely used in structural health monitoring due to the following merits: robust to electromagnet interference, multipoint distributed measurements, easy to embed in… (More)
A full analysis of distributed polarization crosstalk in straight through waveguide was proposed. The measuring error caused by dispersion was eliminated by using dispersion compensation. The results… (More)