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Electrochemical migration (ECM) characteristic is a new reliability failure. A parallel surfacial electrode system coupling with scanning electron microscope (SEM), energy dispersive X-ray analysis (EDAX), and X-ray Diffraction (XRD) technologies is designed to research ECM behavior of 64Sn-35Bi-1Ag (SBA) solder in 3.5 g/L NaCl solution and compare to that(More)
The growth of Staphylococcus aureus under the action of six kinds of Schiff bases (A, B, C, D, E, F) was studied by means of microcalorimetry. Growth constant k and inhibition ratio I were calculated. Also, the antibacterial activity, the action characteristics and the structure-activity relationships of the compounds on S. aureus were analyzed. Results(More)
Flavonols are plant pigments that are ubiquitous in nature. Morin and other related plant flavonols have come into recent prominence because of their usefulness as anticancer, anti-tumor, anti-AIDS, and other important therapeutic activities of significant potency and low systemic toxicity. The heat of combustion of morin (molecular formula, C15H10O7·H2O)(More)
With development of miniaturization, high integration, multifunction and high efficiency of electronic packaging technology, a higher requirement for soldering material and its enlistment property is needed. It is easily subjected to reliability failure for electronic products or components packaged with micro/nanoelectronic packaging technology. In this(More)
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