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This paper reviews the possible causes and effects for no-fault-found observations and intermittent failures in electronic products and summarizes them into cause and effect diagrams. Several types of intermittent hardware failures of electronic assemblies are investigated, and their characteristics and mechanisms are explored. One solder joint intermittent(More)
A design of experiments was conducted to determine the reliability of plastic ball grid array packages under various manufacturing and multiple environmental loading conditions. Parameters included conformal coating methods, underfill, solder mask defined and non-solder mask defined pads. Board level temperature cycling, vibration, and combined temperature(More)
This study investigates the effects of printed circuit board (PCB) material on interconnect durability of lead free assemblies. The assemblies involve soldering various packages (array and peripheral) on to FR4, high glass transition temperature (T g) FR4 and Polyimide (PI) printed circuit boards using Sn3Ag0.5Cu solder alloy. The glass transition(More)
New construction of fine pitch plastic ball grid array (FBGA) has been investigated through experimentation and physics of failure (PoF) analysis based on the reliability point of view. In this study, a three dimensional FEA model was developed to understand the thermomechanical behavior of FBGA under cyclic thermal loading environments. Experimental(More)
Concurrent vibration and thermal environment is commonly encountered in the service life of electronic equipment, including those used in automotive, avionic, and military products. Though extensive research exists in literature for solder joint failures due to thermal cycling, limited research has been conducted on investigating solder joint failures due(More)
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