• Publications
  • Influence
Modeling RF Window Breakdown: From Vacuum Multipactor to Volumetric Ionization Discharge
Plasma breakdown at dielectric windows the output of high power microwave systems has become an important challenge with the advent of GW power level sources. In this work, we report a number ofExpand
  • 7
EDITORIAL - Power Modulators and Repetitive Pulsed Power
Plasma breakdown at dielectric windows in the output of high power microwave systems has become an important challenge with the advent of GW power level sources. The modeling and simulations haveExpand
  • 3
Electromagnetic and 3D Effects in the Multipactor Discharge on a Dielectric
In high-power microwave systems with and without the background gas, the effect of the transverse field structure on the discharge is investigated by comparing the pseudo-3D simulation in TE10 modeExpand
  • 2
Transition of dielectric window breakdown from vacuum multipactor to collisional microwave discharge: a general scaling law
Summary form only given. Dielectric window breakdown remains a significant issue for high power microwave systems. Using a particle-in-cell model with Monte Carlo collisions, we investigate theExpand
  • 2
Transition of Window Breakdown from the Vacuum Multipactor Discharge to the Collisional RF Plasm
In high-power microwave systems, we investigate the transition of breakdown from single surface vacuum multipactor discharge to collisional rf plasma in argon. As the gas pressure increases,Expand
  • 1
Validity of the Two-Term Boltzmann Approximation Employed in Fluid Models
Summary form only given. Typical fluid models in gas discharges use results (such as transport and rate coefficients) of a Boltzmann equation solver as input data. Many Boltzmann equation solversExpand
  • 1
Magnetizing angle dependence of pinning field distribution in 2605CO metglas
lotrcduction The domain wall pinning plays a significant role on the magnetic properties related to microscopic wall motion, and the Eoacivity has been fitted using a pinning model [l]. However,Expand
A nondestructive approach to predict the failure time of thin-film interconnects under high-stress current
We describe a rapid nondestructive approach to predict the failure time for thin-film interconnects. The prediction is made on the basis of the percolation theory and the scaling model, and isExpand