H.P. Baltes

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For the first time a packaged single-chip anemometry microsystem is reported. The system includes a thermal CMOS flow sensor with on-chip power management, signal conditioning, and A/D conversion. It is fabricated using an industrial IC process followed by post-CMOS micromachin-ing. The system is packaged on a flexible substrate using flip-chip(More)
The numerical analysis of carrier transport in magnetic-field-sensitive integrated bipolar transistors is presented. The resulting distributions of potential and current density were obtained for a lateral CMOS NPN dual-collector magne totransistor, in the presence of a magnetic field perpendicular to the device surface.
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