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Demands for mobile phones with smaller form factor and lower cost have driven enhanced integration of electronics components. However, surface acoustic wave (SAW) filters must be fabricated on piezoelectric substrates, and so they are difficult to monolithically integrate on semiconductor chips. This paper reports on a compact wafer-scale packaged SAW(More)
Enhanced integration of mobile phone components is driven by demands for reduced form factor and cost. Because SAW filters must be fabricated on piezoelectric substrates, they are difficult to monolithically integrate on semiconductor chips. Here we report on the integration of a compact wafer-scale packaged SAW filter stacked over a transceiver chip in a(More)
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