Guanghua Wu

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—Thermal characteristics of submicron vias strongly impact reliability of multilevel VLSI interconnects. The magnitude and spatial distribution of the temperature rise around a via are important to accurately estimate interconnect lifetime under electromigration (EM), which is temperature dependent. Localized temperature rise can cause stress gradients(More)
BACKGROUND The highly heterogenic characteristic of viruses is the major obstacle to efficient DNA amplification. Taking advantage of the large number of virus DNA sequences in public databases to select conserved sites for primer design is an optimal way to tackle the difficulties in virus genome amplification. RESULTS Here we use hepatitis B virus as an(More)
This paper reports the use of a novel thermometry technique, scanning Joule expansion microscopy (SJEM), to study the steady state and dynamic thermal behavior of small geometry vias under sinusoidal and pulsed current stress for the first time. Spatial distribution of temperature rise surrounding a sub-micron via has been determined and the corresponding(More)
" Overhauser dynamic nuclear polarization and molecular dynamic simulations using pyrroline and piperidine ring nitroxide radicals, " Relationship between macroscopic properties and polymer architecture in hydrogen bonded thermoplastic elastomers, " Topological analysis of polymeric melts: Chain-length effects and fast-converging estimators for entanglement(More)
This is a retraction of the article submitted by Zhang et al. Virology J 2007, 4:92 Retraction Mr. Wu submitted this article [1] to Virology Journal on the assumption that the co-authors had agreed to the submission. Since this is not the case, the authors are retracting the article. Mr. Wu is deeply sorry for any inconvenience this may have caused to the(More)
This paper reports the use of a novel thermometry technique, scanning Joule expansion microscopy (SJEM), to study the steady state and dynamic thermal behavior of small geometry vias under sinusoidal and pulsed current stress for the first time. Spatial distribution of temperature rise surrounding a sub-micron via has been determined and the corresponding(More)
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