Gerald McVicker

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System-on-Package (SOP) technology based on silicon carriers has the potential to provide modular design flexibility and high-performance integration of heterogeneous chip technologies and to support robust chip manufacturing with high-yield/low-cost chips for a wide range of two-and three-dimensional product applications. Key technology enablers include(More)
Development of complex electronic packages requires a judicious combination of experimentation and modeling. Fabrication costs of electronic packaging prototypes can be prohibitive; therefore, the building of effective virtual prototypes provides an important challenge for the modeling community. Fortunately, finite-element modeling (FEM) has become(More)
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