Gerald McVicker

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of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection J. U. Knickerbocker P. S. Andry L. P. Buchwalter A. Deutsch R. R. Horton K. A. Jenkins Y. H. Kwark G. McVicker C. S. Patel R. J. Polastre C. Schuster A. Sharma S. M. Sri-Jayantha C. W. Surovic C. K. Tsang B. C. Webb S. L. Wright S. R.(More)
Development of complex electronic packages requires a judicious combination of experimentation and modeling. Fabrication costs of electronic packaging prototypes can be prohibitive; therefore, the building of effective virtual prototypes provides an important challenge for the modeling community. Fortunately, finite-element modeling (FEM) has become(More)
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