Geetha Fonseka

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In the competition of market share of quad flat no-lead (QFN) package, there were several improvement methods being utilized, such as leadframe design for higher density, cheaper tape, and more functionalities per chip (with smaller package size, larger die, and smaller pad size). Most of these improvement methods created extremely weak wire bonding(More)
The quad flat no-lead (QFN) package has gained great semiconductors market due to its advantages in thermal and electrical performance. In the further package miniaturization, challenges happened in assembly die attach and wire bonding processes, affected by extremely small and slim package size. The miniature QFN package success relied on epoxy dispensing(More)
In the competition of market share of quad flat no-lead (QFN) package, there were several improvement methods being utilized, such as leadframe design for higher density, cheaper tape, and more functionalities per chip (with smaller package size, larger die, and smaller pad size). Most of these improvement methods created extremely weak die attach and wire(More)
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