Gayatri Cuddalorepatta

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This study investigates the time dependent behavior of lead-free hypoeutectic Sn3.0Ag0.5Cu solder using a combination of experimentation and modeling. Experimental data for hypoeutectic Sn3.0Ag0.5Cu (SAC) is obtained from stress relaxation tests at different temperatures and different initial stress levels, and compared with the benchmark eutectic Sn37Pb,(More)
Most studies on modeling cyclic thermo- mechanical fatigue of solder interconnects consider only the steady-state creep behavior of solder materials. This study explores the effect of including the primary creep behavior; since it may represent a significant portion of the total viscoplastic deformations in Pb-free Sn3.0Ag0.5Cu (SAC305) solder (G.(More)
This study examines the effect of cyclic damage on the constitutive response of Sn3.0Ag0.5Cu (SAC305) solder material. Cyclic damage is induced through isothermal, mechanical cycling tests at high strain rate and room temperature, using a modified lap-shear microscale specimen (180 µm wide solder joint). The elastic, plastic, and yield response of(More)
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