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Ultra-High Reliability Flip Chip on Laminate For Harsh Environments
In this work, we report on our efforts to develop ultra-high reliability flip chip on laminate assemblies for deployment in harsh thermal cycling environments characteristic of ground and aerospaceExpand
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Drop Reliability of Corner Bonded CSP in Portable Products
The use of CSPs has expanded rapidly, particularly in portable electronic products. Many CSP designs will meet the thermal cycle or thermal shock requirements for these applications. However,Expand
  • 7
  • 1
Nano-Underfills for High-Reliability Applications in Extreme Environments
Silica particles are used as a filler material in electronic underfills to reduce coefficient of thermal expansion of the underfill-epoxy matrix. In traditional underfills, the size of silicaExpand
  • 14
Lead-free solder flip chip-on-laminate assembly and reliability
This paper examines the assembly process for flip chip die with SnAgCu solder bumps and the results of liquid-to-liquid thermal shock testing. The SnAgCu alloy required a thicker dip layer of flux toExpand
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Kinetic modeling of no-flow underfill cure and its relationship to solder wetting and voiding
The cure kinetics of an epoxy-based no-flow, fluxing underfill were determined using isothermal differential scanning calorimetry (DSC), and then fit to a differential Avrami equation. Integration ofExpand
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Nano-Underfills for High-Reliability Applications in Extreme Environments
Silica particles are used as a filler material in elec- tronic underfills to reduce coefficient of thermal expansion of the underfill-epoxy matrix. In traditional underfills, the size of silicaExpand
  • 8
Drop-Impact Reliability of Chip-Scale Packages in Handheld Products
The use of CSPs has expanded rapidly, particularly in portable electronic products. Many CSP designs will meet the thermal cycle or thermal shock requirements for these applications. However,Expand
  • 5
Risk Management Models for Flip-Chip Electronics in Extreme Environments
In this work, risk-management and decision-support models for reliability prediction of flip chip packages in harsh environments have been presented. The models presented in this paper provideExpand
  • 8
Advances in flip chip underfill technology for lead-free component packaging
Lead containing solders have been employed as an interconnecting and surface coating material in many applications for decades. The two driving forces that affect the present and future requirementsExpand
  • 2
LORD SolderBrace™ Wafer Applied Coating for Improved Reliability and Throughput in WLCSP
As more manufacturers look to increase the size of Wafer Level Chip Scale Package (WLCSP) dies and also look to decrease the ball pitch, the susceptibility of the die to fail during thermal cyclingExpand
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