G. J. Chern

We don’t have enough information about this author to calculate their statistics. If you think this is an error let us know.
Learn More
SiGe/Si HBT combining the integration and cost benefits of silicon has came of age as an ideal process for wireless/wired communication applications. To encompass both high-speed analog and wireless circuit applications, production-proven Spice model of HBT that allows the great amount of flexibility and provides excellent model accuracy over a broad range(More)
To conciliate scaling-driven fundamental material limitations with industry evolution requirements, flexible CMOS technologies and tighter interaction between process development and circuit/system design are needed to efficiently realize systems on a chip (SoC). This paper discusses issues associated with power supply scaling, performance-leakage power(More)
  • 1