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In the microelectronics industry, power has traditionally been the key driver for thermal management. Cooling solutions are typically rated in terms of their power dissipation capacity and efficiency. However, overall power is not the only parameter that affects thermal management. For instance, it is well-known that power density is also important (i.e.,(More)
This paper discusses the investigation of module cooling utilizing an enhanced thermosyphon heat loop as an alternative to direct air cooling or liquid-to-air cooling with forced convection of the liquid. Using water as the working fluid in the thermosyphon, experiments were conducted to investigate the effects of fill volume, heat load, and condenser air(More)
Thin-film thermoelectrics (TECs) are potential candidates for cooling microprocessors due to their large cooling power density and ability to integrate with packages. In addition, there are no moving parts or noise generated during their operation. In particular, thin-film TECs offer the ability to cool localized regions of high heat flux (hot spots) in the(More)
Thermal design power trends and power densities for present and future single-core microprocessors are investigated. These trends are derived based on Moore's law and scaling theory. Both active and stand-by power are discussed and accounted for in the calculations. A brief discussion of various leakage power components and their impact on the power density(More)
As CMOS technology scales to nanometer regime, power dissipation issues and associated thermal problems have emerged as critical design concerns in most high-performance integrated circuits (ICs) including microprocessors. In this scenario, accurate estimation of the silicon junction (substrate or die) temperature is crucial for various performance analyses(More)
A numerical study is performed to characterize the thermal and mechanical performances of silicon/water vapor chambers as heat spreaders for electronics cooling applications and to compare their performance against Cu heat spreaders. 2D flow and energy equations are solved in the vapor and liquid regions, along with conduction in the wall. An equilibrium(More)
The paper introduces the novel concept of using carbon nano tube (CNTs) based wick structures for high performance heat pipes and vapor chambers. This ongoing research aims to replace the copper wick structures with high conductive CNT wick structures. Individual carbon nanotubes possess extremely high thermal conductivities of the order of 2000-3000 W/m-K.(More)
Microprocessors continue to grow in capabilities, complexity and performance. Microprocessors typically integrate functional components such as logic and level two (L2) cache memory in their architecture. This functional integration of logic and memory results in improved performance of the microprocessor. However, the integration also introduces a layer of(More)
Microprocessors continue to grow in capabilities, complexity and performance. The current generation of microprocessors integrates functional components such as logic and level two (L2) cache memory into the microprocessor architecture. The functional integration of the microprocessor has resulted in better performance of the microprocessor as the clock(More)
As transistors continue to evolve along Moore's Law and silicon devices take advantage of this evolution to offer increasing performance, there is a critical need to accurately estimate the silicon-substrate (junction or die) thermal gradients and temperature profile for the development and thermal management of future generations of all high-performance(More)
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