Göran Eggers

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An accurate prediction of junction temperatures in memory modules is necessary for an appropriate design of a thermal system solution. For this reason, a thermal analysis of the accuracy of usual techniques for modelling the different components of a memory module is afforded in this paper. A first theoretical analysis of the characteristics and problems of(More)
An Experimental Setup for Validating a CFD Model of a Double-sided PCB in a Sealed Enclosure at Various Power Configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127 J. Johnsson, I. Belov, P. LRisner Validation of FE Model for Transient Hot Wire Thermal Conductivity Measurements , * 134 J. Bilek, Dr J. Atkinson, Prof W Wakeham(More)
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